| # | Part Number | Description | Manufacturer |
|---|---|---|---|
| 1 | GBDT | MOUNT MAGN 3/4" TEFLEX TNCM | Laird Technologies IAS |
| 2 | MMZ09332BT1 | IC AMP HBT INGAPRF Amplifier IC LTE, TDS-CDMA, W-CDMA 130MHz ~ 1GHz 12-QFN (3x3) | NXP USA Inc |
| 3 | G6A-274P-ST15-US-DC48 | RELAY GEN PURPOSE DPDT 2A 48VGeneral Purpose Relay DPDT (2 Form C) Through Hole | Omron Electronics Inc-EMC Div |
| 4 | NC4-JPS | SOCKET PCB FOR FLAT NC4D-JPRelay Socket Through Hole | Panasonic Electric Works |
| 5 | T90N5D42-24 | RELAY GEN PURPOSE SPDT 20A 24VGeneral Purpose Relay SPDT (1 Form C) 24VDC Coil Through Hole | TE Connectivity Potter & Brumfield Relays |
| 6 | 1-1415898-4 | RELAY GEN PURPOSE SPST 16A 24VGeneral Purpose Relay SPST-NO (1 Form A) 24VDC Coil Through Hole | TE Connectivity Potter & Brumfield Relays |
| 7 | P9EC-C | TERMINAL COVER FOR G9EC-1 RELAYCover, Terminal G9EC-1 Series | Omron Electronics Inc-EMC Div |
| 8 | CB1AF-M-12V | RELAY AUTOMOTIVE SPST 40A 12V | Panasonic Electric Works |
| 9 | Y92B-A150N | HEAT SINK FOR 25A G3NA SERIESHeat Sink G3NA Series | Omron Automation and Safety |