| # | Part Number | Description | Manufacturer |
|---|---|---|---|
| 1 | 113100001 | XBEE BREAKOUT KIT | Seeed Technology Co., Ltd |
| 2 | BGM1013,115 | MMIC AMPLIFIER 6TSSOPRF Amplifier IC ISM 0Hz ~ 2.2GHz 6-TSSOP | NXP USA Inc |
| 3 | 1462039-6 | RELAY TELECOM DPDT 2A 24VTelecom Relay DPDT (2 Form C) Surface Mount | TE Connectivity Potter & Brumfield Relays |
| 4 | DS2E-S-DC9V | RELAY GENERAL PURPOSE DPDT 2A 9VGeneral Purpose Relay DPDT (2 Form C) Through Hole | Panasonic Electric Works |
| 5 | 5-1462037-5 | RELAY TELECOM DPDT 2A 3VTelecom Relay DPDT (2 Form C) Surface Mount | TE Connectivity Potter & Brumfield Relays |
| 6 | G5V-2-DC24 | RELAY GEN PURPOSE DPDT 2A 24VGeneral Purpose Relay DPDT (2 Form C) Through Hole | Omron Electronics Inc-EMC Div |
| 7 | RSL116068 | EXTENDED HEIGHT, 2 POLE/10 AMP,Relay | Amphenol Pcd |
| 8 | 1393824-5 | RELAY SOCKET SOLDER SIZE IIRelay Socket Panel Mount | TE Connectivity Potter & Brumfield Relays |
| 9 | RY531024 | RELAY GEN PURPOSE SPST 8A 24VGeneral Purpose Relay SPST-NO (1 Form A) 24VDC Coil Through Hole | TE Connectivity Potter & Brumfield Relays |