| # | Part Number | Description | Manufacturer |
|---|---|---|---|
| 1 | 9397 750 16017 | KIT MMIC SAMPLE BINDER | NXP USA Inc |
| 2 | LX5518LQ-TR | IC HBT 2.4GHZ-2.5GHZ PA 16-QFNRF Amplifier IC 802.11b/g/n 2.4GHz ~ 2.5GHz | Microsemi Corporation |
| 3 | TXD2-12V | RELAY GEN PURPOSE DPDT 2A 12VGeneral Purpose Relay DPDT (2 Form C) Through Hole | Panasonic Electric Works |
| 4 | RSL116067 | EXTENDED HEIGHT, 2 POLE/10 AMP,Relay | Amphenol Pcd |
| 5 | 1-1415526-1 | SOCKET W/SCREW FOR DINRAIL 4PRelay Socket DIN Rail | TE Connectivity Potter & Brumfield Relays |
| 6 | 1-1415899-2 | RZ01-1C4-D048Relay Coil | TE Connectivity Potter & Brumfield Relays |
| 7 | DSP2A-L2-DC3V | RELAY GENERAL PURPOSE DPST 5A 3VGeneral Purpose Relay DPST-NO (2 Form A) 3VDC Coil Through Hole | Panasonic Electric Works |
| 8 | HS501DR | HEATSINK SSR 5.0DEG C/W DIN MNTHeat Sink Multiple Series | Sensata-Crydom |
| 9 | 2962201 | I/O MOUNTING BOARD 16POSI/O Module Rack 16 Channel | Phoenix Contact |