• Manufacturer Part# 1N5934BRLG
  • Product CategoryDiscrete Semiconductor Products
  • Short DescriptionDIODE ZENER 24V 3W AXIALZener Diode 24V 3W ±5% Thr...
  • More DetailN/A
In Stock: 25587

Can ship immediately

Technical Details

  • Series:--
  • Packaging:Tape & Reel (TR) 
  • Part Status:Active
  • Voltage - Zener (Nom) (Vz):24V
  • Tolerance:±5%
  • Power - Max:3W
  • Impedance (Max) (Zzt):19 Ohms
  • Current - Reverse Leakage @ Vr:1µA @ 18.2V

 

  • Voltage - Forward (Vf) (Max) @ If:1.5V @ 200mA
  • Operating Temperature:-65°C ~ 200°C
  • Mounting Type:Through Hole
  • Package / Case:DO-204AL, DO-41, Axial
  • Supplier Device Package:Axial
  • Base Part Number:1N5934

Description

1. Description

This is a complete series of 3 W Zener diodes with limits and Excellent operating characteristics reflect excellent functions Silicon oxide passivates the junction. All this is in the axial lead Transfer molded plastic packaging provides all common protection Environmental conditions.

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2. Feature

    1. Zener voltage range − 3.3 V to 200 V

    2. The ESD level of each human body model is level 3 (> 16 KV)

    3. Surge rating is 98 W @ 1 ms

    4. Maximum limit of six electrical parameters can be guaranteed

    5. The package does not exceed the conventional 1 W package

    6. Lead-free package available

3. Mechanical behavior

Examples: no voids, transfer molding, thermosetting plastics Surface treatment:  all outer surfaces are corrosion-resistant and contain lead Easy to solder

Maximum lead temperature for soldering:  260°C, 1/16 inch from the shell, lasting 10 seconds

Polarity:  the cathode is represented by the polarity band Installation location: Any

4. Application function tips

Since the actual voltage that a given Zener diode can provide The diode is temperature dependent, it is necessary to determine Junction temperature under any set of working conditions In order to calculate its value. The following process is recommended:

The lead temperature TL should be determined according to the following conditions:

                image.png

LA is the thermal resistance from the lead to the environment (°C / W) PD is power consumption. The value of LA will be different, It depends on the installation method of the device. Los Angeles average Common various clamps and connection points are 30−40°C/W Used for printed circuit board wiring.

The temperature of the lead can also be used Place the thermocouple as close to the wire as possible Tie point. The thermal mass connected to the connection point is Usually large enough not to be too large Respond to the heat surge generated in the diode due to the following reasons Once the steady state condition is reached, pulse operation is performed. 

Use the measured value of TL, junction temperature May depend on:

                   image.png

TJL is the increase in junction temperature above the leadtemperature and may be found from Figure 2 for a train ofpower pulses (L = 3/8 inch) or from Figure 10 for dc power.

                     image.png

For worst-case design, using expected limits of IZ, limitsof PD and the extremes of TJ (TJ) may be estimated.Changes in voltage, VZ, can then be found from:

                     image.png

VZ, the zener voltage temperature coefficient, is foundfrom Figures 5 and 6.Under high power-pulse operation, the zener voltage willvary with time and may also be affected significantly by thezener resistance. For best regulation, keep currentexcursions as low as possible.Data of Figure 2 should not be used to compute surgecapability. Surge limitations are given in Figure 3. They arelower than would be expected by considering only junctiontemperature, as current crowding effects cause temperaturesto be extremely high in small spots resulting in devicedegradation should the limits of Figure 3 be exceeded.

5. PACKAGE DIMENSIONS

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