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1. Description
Advanced HEXFET® Power MOSFET from International Rectifier The use of advanced processing technology to achieve a positively low on-resistance per silicon surface. This benefit, combined with fast HEXFET power supply switching speed and rugged equipment design MOSFET is well known, it provides designers with extremely Efficient and reliable equipment suitable for various applications. D2Pak is a surface mount power package that can It can accommodate chip sizes up to HEX-4. It provides the highest power Has the lowest on-resistance in any existing surface mount package. D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W of power in typical surface mount applications. Through-hole version (IRF3205L) can be used for low profile application.
2. Feature
1. Advanced Process Technology
2. Ultra Low On-Resistance
3. Dynamic dv/dt Rating
4. 175°C Operating Temperature
5. Fast Switching
6. Fully Avalanche Rated
7. Lead-Free
3. Electrical Characteristics
4. Package Outline
