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1. Description
This device uses the Schottky Barrier principle with a large area metal−to−silicon power diode. Ideally suited for low voltage, high frequency rectification or as free wheeling and polarity protection diodes in surface mount applications where compact size and weight are critical to the system. This package also provides an easy to work with alternative to leadless 34 package style. Because of its small size, it is ideal for use in portable and battery powered products such as cellular and cordless phones, chargers, notebook computers, printers, PDAs and PCMCIA cards. Typical applications are AC−DC and DC−DC converters, reverse battery protection, and “Oring” of multiple supply voltages and any other application where performance and size are critical.
2. Features
1. Guardring for Stress Protection
2. Low Forward Voltage
3. 125°C Operating Junction Temperature
4. Epoxy Meets UL 94 V−0 @ 0.125 in
5. Package Designed for Optimal Automated Board Assembly
6. ESD Rating:
- Human Body Model = 3B
- Machine Model = C
7. NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
8. These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant
3. Mechanical Characteristics
1. Device Marking: L4F
2. Polarity Designator: Cathode Band
3. Weight: 11.7 mg (approximately)
4. Case: Epoxy, Molded
5. Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable
6. Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds
4. product information
5. ELECTRICAL CHARACTERISTICS
6. PACKAGE DIMENSIONS
