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1. TYPICAL APPLICATIONS
Use in sensitive electronics protection against voltage transients induced by inductive load switching and lighting on ICs, MOSFET, signal lines of sensor units for consumer, computer, industrial, automotive, and telecommunication.
2. FEATURES
1. Low profile package
2. Ideal for automated placement
3. Glass passivated chip junction
4. Available in unidirectional and bidirectional
5. 400 W peak pulse power capability with a 10/1000 μs waveform, repetitive rate (duty cycle): 0.01 % (300 W above 78 V)
6. Excellent clamping capability
7. Very fast response time
8. Low incremental surge resistance
9. Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
10. AEC-Q101 qualified available
- Automotive ordering code: base P/NHE3 or P/NHM3
3. PRIMARY CHARACTERISTICS
4. MECHANICAL DATA
1. Molding compound meets UL 94 V-0 flammability rating
2. Base P/N-E3 - RoHS-compliant, commercial grade
3. Base P/N-M3 - halogen-free, RoHS-compliant, commercial grade
4. Base P/NHE3_X - RoHS-compliant and AEC-Q101 qualified
5. Base P/NHM3_X - halogen-free, RoHS-compliant, and AEC-Q101 qualified
6. Terminals: matte tin plated leads, solderable per J-STD-002 and JESD 22-B102E3, M3, HE3, and HM3 suffix meets JESD 201 class 2 whisker test
7. Polarity: for unidirectional types the band denotes cathode end, no marking on bidirectional types
5. PACKAGE OUTLINE DIMENSIONS
