• Manufacturer Part# DS34S132GN+
  • Product CategoryIntegrated Circuits (ICs)
  • Short DescriptionIC TDM OVER PACKET 676-BGA
  • More DetailTelecom IC TDM-over-Packet (TDMoP) 676-TEPBGA (27x...
In Stock: 53

Can ship immediately

Technical Details

  • Series:--
  • Packaging:Tray 
  • Part Status:Active
  • Function:TDM-over-Packet (TDMoP)
  • Interface:TDMoP
  • Number of Circuits:1
  • Voltage - Supply:1.8V, 3.3V
  • Current - Supply:--

 

  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:676-BGA
  • Supplier Device Package:676-TEPBGA (27x27)
  • Includes:--
  • Base Part Number:DS34S132

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