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1. DESCRIPTION
Third generation power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The D2PAK (TO-263) is a surface mount power package capable of accommodating die size up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2PAK (TO-263) is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0 W in a typical surface mount application.
2. FEATURES
1. Surface mount
2. Available in tape and reel
3. Dynamic dV/dt rating
4. Repetitive avalanche rated
5. Fast switching
6. Ease of paralleling
7. Simple drive requirement
3. Package Information
