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1. Describe
The device provides a bidirectional, half-duplex communication physical interface for automotive and industrial LIN systems compliant with LIN Bus Specification Revision 2.1 and SAE J2602. The device is protected against short circuits and overheating by an internal circuit. The device is specifically designed to withstand all specified transient conditions in an automotive operating environment while meeting all stringent quiescent current requirements.
2. Feature
1. MCP2003 and MCP2004 are compliant with LIN bus specification 1.3, 2.0 and 2.1 and are compliant with SAE J2602
2. Supports baud rates up to 20 Kbaud using LIN compatible output drivers
3. 43V load dump protection
4. Very low EMI meets stringent OEM requirements
5. Very high ESD immunity:
- >20kV on VBB (IEC 61000-4-2)
- >14kV on LBUS (IEC 61000-4-2)
6. Very high RFI immunity meets stringent OEM requirements
7. Wide supply voltage, 6.0V-27.0V continuous
8. Extended temperature range: -40 to +125°C
9. Interface to PIC® MCU EUSART and standard USART
10. Local Interconnect Network (LIN) bus pins:
- Internal pull-up resistors and diodes
- Prevent battery short circuit
- Prevent ground loss
- High current drive
11. Automatic thermal shutdown
12. Low Power Mode:
- Receiver monitoring bus and transmitter off, (≌ 5 µA)
3. Pin configuration
4. Pin Description
