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1. Description
The SLD8S Series is SMTO-263 packaged with leaded modification and is designed to provide precision overvoltage protection for sensitive electronics.
2. Features
1. AEC-Q101 qualified
2. SMTO-263 package, and foot print is compatible to industrial popular DO218AB package
3. Meet ISO7637-2 5a/5b protection and ISO16750 load dump test (refer to APP note for details)
4. VBR @ TJ = VBR@25°C x (1+αT x (TJ - 25)) (αT:Temperature Coefficient, typical value is 0.1%)
5. Glass passivated chip junction in modified TO263 package
6. IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact)
7. ESD protection of data lines in accordance with IEC 61000-4-2
8. EFT protection of data lines in accordance with IEC 61000-4-4
9. Fast response time: typically less than 1.0ps from 0 Volts to BV min
10. Excellent clamping capability
11. Low incremental surge resistance
12. Plastic package is flammability rated V-0 per Underwriters Laboratories
13. Meet MSL level 1, per J-STD-020, LF maximun peak of 260°C
14. For surface mounted applications to optimize board space
15. Low profile package
16. High temperature to reflow soldering guaranteed: 260°C/10sec at terminals
17. Matte tin lead–free plated
18. Halogen free and RoHS compliant
19. Pb-free E3 means 2nd level interconnect is Pbfree and the terminal finish material is tin (Sn) (IPC/ JEDEC J-STD-609A.01)
3. Applications
Designed to protect sensitive electronics from:
- Inductive Load Switching
- Alternator Load Dump
4. Functional Diagra

5. Maximum Ratings and Thermal Characteristics

6. Dimensions
