TMS320F28335PGFA

Description of TMS320F28335

C2000™ 32-bit microcontrollers are optimized for processing, sensing and driving to improve closed-loop performance in real-time control applications (such as industrial motor drives); solar inverters and digital power supplies; electric vehicles and transportation; motor control; As well as sensing and signal processing. The C2000 series includes Delfino™ Premium Performance series and Piccolo™ Entry Performance series.

The TMS320C2000™ 32-bit microcontroller is optimized for processing, sensing and driving to improve closed-loop performance in real-time control applications. The C2000™ microcontroller series includes Delfino™ Premium Performance microcontroller series and Piccolo™ Entry Performance microcontroller series.

TMS320C28x / Delfino™ DSC / MCU members TMS320F28335, TMS320F28334, TMS320F28333, TMS320F28332, TMS320F28235, TMS320F28234 and TMS320F28232 are highly integrated high-performance solutions suitable for demanding control applications.

Throughout this document, the devices are abbreviated as F28335, F28334, F28333, F28332, F28235, F28234, and F28232. F2833x Device Comparison and F2823x Device Comparison provide a summary of the capabilities of each device. For more specific content, please browse our PDF

  1. High-performance static CMOS technology

      Up to 150 MHz (6.67-ns cycle time)

      1.9-V/1.8-V core, 3.3-V I/O design

  2. High-performance 32-bit CPU (TMS320C28x)

      IEEE 754 single-precision Floating-Point Unit (FPU) (F2833x only)

     16 × 16 and 32 × 32 MAC operations

     16 × 16 dual MAC

     Harvard bus architecture

     Fast interrupt response and processing

     Unified memory programming model

     Code-efficient (in C/C++ and Assembly)

  3. Six-channel DMA controller (for ADC, McBSP, ePWM, XINTF, and SARAM)

  4. 16-bit or 32-bit External Interface (XINTF)

      More than 2M × 16 address reach

  5. On-chip memory

      F28335, F28333, F28235:

      256K × 16 flash, 34K × 16 SARAM

      F28334, F28234:

      128K × 16 flash, 34K × 16 SARAM

      F28332, F28232:

      64K × 16 flash, 26K × 16 SARAM

      1K × 16 OTP ROM

  6. Boot ROM (8K × 16)

       With software boot modes (through SCI, SPI, CAN, I2C, McBSP, XINTF, and parallel I/O)

       Standard math tables

  7. Clock and system control

       On-chip oscillator

       Watchdog timer module

  8. GPIO0 to GPIO63 pins can be connected to one of the eight external core interrupts

  9. Peripheral Interrupt Expansion (PIE) block that supports all 58 peripheral interrupts

10. 128-bit security key/lock

       Protects flash/OTP/RAM blocks

       Prevents firmware reverse-engineering

11. Enhanced control peripherals

       Up to 18 PWM outputs

       Up to 6 HRPWM outputs with 150-ps MEP resolution

       Up to 6 event capture inputs

       Up to 2 Quadrature Encoder interfaces

       Up to 8 32-bit timers

       (6 for eCAPs and 2 for eQEPs)

       Up to 9 16-bit timers

       (6 for ePWMs and 3 XINTCTRs)

12. Three 32-bit CPU timers

13. Serial port peripherals

       Up to 2 CAN modules

       Up to 3 SCI (UART) modules

       Up to 2 McBSP modules (configurable as SPI)

       One SPI module

       One Inter-Integrated Circuit (I2C) bus

14. 12-bit ADC, 16 channels

      80-ns conversion rate

      2 × 8 channel input multiplexer

      Two sample-and-hold

      Single/simultaneous conversions

      Internal or external reference

15. Up to 88 individually programmable, multiplexed GPIO pins with input filtering

16. JTAG boundary scan support

      IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture

17. Advanced emulation features

      Analysis and breakpoint functions

      Real-time debug using hardware

18. Development support includes

      ANSI C/C++ compiler/assembler/linker

      Code Composer Studio™ IDE

      DSP/BIOS™ and SYS/BIOS

      Digital motor control and digital power software libraries

19. Low-power modes and power savings

      IDLE, STANDBY, HALT modes supported

      Disable individual peripheral clocks

20. Endianness: Little endian

21. Package options:

      Lead-free, green packaging

      176-ball plastic Ball Grid Array (BGA) (ZJZ)

      179-ball MicroStar BGA™ (ZHH)

      176-pin Low-Profile Quad Flatpack (LQFP) (PGF)

      176-pin Thermally Enhanced Low-Profile Quad Flatpack (HLQFP) (PTP)

22. Temperature options:

       A: –40°C to 85°C (PGF, ZHH, ZJZ)

       S: –40°C to 125°C (PTP, ZJZ)

       Q: –40°C to 125°C (PTP, ZJZ)

(AEC Q100 qualification for automotive applications)

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